Measurement of strain in Al-Cu interconnect lines with x-ray microdiffraction

Journal of Applied Physics

Volumn 86, Issue 2, 1999, Pages 884-890

  Solak, H H ^a   Vladimirsky, Y ^a   Cerrina, F ^a   Lai, B ^b   Yun, W ^b   Cai, Z ^b   Ilinski, P ^b   Legnini, D ^b   Rodrigues, W ^b  

^a University of Wisconsin Madison   (United States)

^b ARGONNE NATIONAL LABORATORY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0012099646     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.370819     Document Type: Article

References (20)

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