Integration of copper with an organic low-k dielectric in 0.12-μm node interconnect

Microelectronic Engineering

Volumn 60, Issue 1-2, 2002, Pages 119-124

  Fayolle, M ^a   Passemard, G ^b   Assous, M ^a   Louis, D ^a   Beverina, A ^b   Gobil, Y ^a   Cluzel, J ^a   Arnaud, L ^a  

^a CEA GRENOBLE   (France)

^b STMICROELECTRONICS   (France)

Author keywords

Copper; Dielectric; Integration; Interconnection; Low k

Indexed keywords

CAPACITANCE; COPPER; DIELECTRIC MATERIALS; ELECTRIC RESISTANCE; PERMITTIVITY; WATER ABSORPTION;

ORGANIC DIELECTRICS;

MICROELECTRONIC PROCESSING;

EID: 0036132760     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0167-9317(01)00587-1     Document Type: Conference Paper

References (5)