Quantitative analysis of strengthening mechanisms in thin Cu films: Effects of film thickness, grain size, and passivation

Journal of Materials Research

Volumn 13, Issue 5, 1998, Pages 1307-1317

  Keller, R M ^a   Baker, S P ^a   Arzt, E ^a  

^a UNIVERSITY OF STUTTGART   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0000403105     PISSN: 08842914     EISSN: None     Source Type: Journal    
DOI: 10.1557/JMR.1998.0186     Document Type: Article

References (34)

1. P.A. Flinn, J. Mater. Res. 6, 1498 (1991).
2. R. P. Vinci, Thermal Strains and Stresses in Copper Thin Films and Microelectronic Interconnect Structures, Ph.D. dissertation, Stanford University (1994).
3. E. M. Zielinski, R. P. Vinci, and J. C. Bravman, J. Electron. Mater. 24 (10), 1485-1492 (1995).
4. M. F. Doerner and W. D. Nix, Solid State and Materials Sciences 14 (3), 225-268 (1988).
5. W. D. Nix, Metall. Trans. A 20A, 2217-2245 (1989).
6. R. Venkatraman and J. C. Bravman, J. Mater. Res. 7, 2040-2048 (1992).
7. L. B. Freund, J. Appl. Mechanics 54, 553-557 (1987).
8. R. Venkatraman and J. C. Bravman, in Thin Films: Stresses and Mechanical Properties III, edited by W. D. Nix, J. C. Bravman, E. Arzt, and L. B. Freund (Mater. Res. Soc. Symp. Proc. 239, Pittsburgh, PA, 1992), pp. 127-132.
9. R-M. Keller, S. P. Baker, A. Kretschmann, R. P. Vinci, and E. Arzt, unpublished.
10. P. A. Flinn, D. S. Gardner, and W. D. Nix, IEEE Trans. Electron Devices 34 (3), 689-699 (1987).
11. The Texwipe Company, 650 East Crescent Avenue, PO.Box 575, Upper Saddle River, New Jersey 07458, TechniCtoth II.
12. P. A. Flinn, private communication.
13. G. G. Stoney, Proc. R. Soc. A82, 172-175 (1909).
14. F. G. von Preissig, J. Appl. Phys. 66 (9), 4262-4268 (1989).
15. W. M. Kuschke, A. Kretschmann, R-M. Keller, R. P. Vinci, C. Kaufmann, and E. Arzt, J. Mater. Res. (in press).
16. A. Kretschmann, Ph.D. dissertation, University of Stuttgart (1997).
17. R-M. Keller, W-M. Kuschke, A. Kretschmann, S. Bader, R. P. Vinci, and E. Arzt, in Materials Reliability in Microelectronics V, edited by A. S. Oates, W. F. Filter, R. Rosenberg, A. L. Greer, and K. Gadepally (Mater. Res. Soc. Symp. Proc. 391, Pittsburgh, PA, 1995), pp. 309-314.
18. R-M. Keller, S. P. Baker, and E. Arzt, unpublished.
19. M. F. Doerner, D. S. Gardner, and W. D. Nix, J. Mater. Res. 1, 845-851 (1986).
20. R-M. Keller, Thermomechanisches Verhalten und MikroStruktur dünner, polykristalliner Kupferschichten, Ph.D. dissertation, University of Stuttgart (1996).
21. T. H. Courtney, Mechanical Behavior of Materials (McGraw-Hill, New York, 1990), p. 171.
22. V. Y. Gertsman, M. Hoffmann, H. Gleiter, and R. Birringer, Acta Metall. Mater. 42 (10), 3539-3544 (1994).
23. P. Chaudhari, Philos. Mag. A 39 (4), 507-516 (1979).
24. T. H. Courtney, Mechanical Behavior of Materials (McGraw-Hill, New York, 1990), p. 167.
25. J. Chauduri, R. Thokala, J. H. Edgar, and B. S. Sywe, Thin Solid Films 274, 23-30 (1996).
26. R-M. Keller, W. Sigle, S. P. Baker, O. Kraft, and E. Arzt, in Thin Films: Stresses and Mechanical Properties VI, edited by W. W. Gerberich, H. Gao, J-E. Sundgrer, and S. P. Baker (Mater. Res. Soc. Symp. Proc. 436, Pittsburgh, PA, 1997).
27. J. C. M. Li, Trans. Metall. Soc. AIME 227, 239-247 (1963).
28. H. J. Frost and M. F. Ashby, Deformation-Mechanism Maps: The Plasticity and Creep of Metals and Ceramics (Pergamon Press, Oxford, 1982), pp. 6-16.
29. S. Bader, P. A. Flinn, E. Arzt, and W. D. Nix. J. Mater. Res. 9, 318-327 (1994).
30. R. P. Vinci, E. M. Zielinski, and J. C. Bravman, Thin Solid Films 262, 142-153 (1995).
31. R. Venkatraman, S. Chen, and J. C. Bravman, J. Vac. Sci. Technol. A9, 2536-2542 (1991).
32. D. S. Gardner and P. A. Flinn, IEEE Trans. Electron Devices 35 (12), 2160-2169 (1988).
33. R. Venkatraman, J. C. Bravman, W. D. Nix, P. W. Davies, P. A. Flinn, and D. B. Fraser, J. Electron. Mater. 19, 1231-1237 (1990).
34. R. Venkatraman, Plasticity and Flow Stresses in Aluminum Thin Films on Silicon, Ph.D. dissertation, Stanford University (1992).