SCOPUS 정보 검색 플랫폼

Microelectronics Reliability

Volumn 42, Issue 6, 2002, Pages 951-966

Mechanical characterization of Sn-Ag-based lead-free solders

(5) Amagai, Masazumi a Watanabe, Masako a Omiya, Masaki b Kishimoto, Kikuo b Shibuya, Toshikazu b

a Texas Instruments Japan Ltd (Japan)

b TOKYO INSTITUTE OF TECHNOLOGY (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

CREEP; DEFORMATION; ENERGY DISPERSIVE SPECTROSCOPY; ENVIRONMENTAL PROTECTION; EUTECTICS; INTERMETALLICS; PLASTICITY; PLATING; RELIABILITY THEORY; SCANNING ELECTRON MICROSCOPY; SOLDERED JOINTS; SOLDERING ALLOYS; TENSILE TESTING; TIN ALLOYS;

EUTECTIC SOLDERS; REFLOW PROCESSES;

MICROELECTRONICS;

EID: 0036603885 PISSN: 00262714 EISSN: None Source Type: Journal
DOI: 10.1016/S0026-2714(02)00017-3 Document Type: Article

Times cited : (251)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.