Effect of grain growth stress and stress gradient on stress-induced voiding in damascene Cu/low-k interconnects for ULSI

Thin Solid Films

Volumn 504, Issue 1-2, 2006, Pages 284-287

  Paik, Jong Min ^a   Park, Il Mok ^a   Joo, Young Chang ^a  

^a Seoul National University   (South Korea)

Author keywords

Damascene Cu low k; Finite element analysis; Hydrostatic stress; X ray diffraction

Indexed keywords

ANNEALING; FINITE ELEMENT METHOD; INTERCONNECTION NETWORKS; STRESSES; THERMAL EXPANSION; X RAY DIFFRACTION;

DAMASCENE CU/LOW-K; DIELECTRIC LAYERS; HYDROSTATIC STRESSES; STRESS GRADIENT;

GRAIN GROWTH;

EID: 33644891008     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tsf.2005.09.013     Document Type: Conference Paper

References (24)

1. T.C. Huang, C.H. Yao, W.K. Wan, C.C. Hsia, and M.S. Liang IITC 2003 207
2. M. Kawano, T. Fukase, Y. Yamamoto, T. Ito, S. Yokogawa, H. Tsuda, Y. Kunimune, T. Saitoh, K. Ueno, and M. Sekine IITC 2003 210
3. Y.K. Lim, Y.H. Lim, C.S. Seet, B.C. Zhang, K.L. Chok, K.H. See, T.J. Lee, L.C. Hsia, and K.L. Pey IRPS 2004 240
4. E.T. Ogawa, J.W. McPherson, J.A. Rosal, K.J. Dickerson, T.-C. Chiu, L.Y. Tsung, M.K. Jain, T.D. Bonifield, J.C. Ondrusek, and W.R. McKee IRPS 2002 312
5. A. Von Glasow, A.H. Fischer, M. Hierlemann, S. Penka, and F. Ungar AMC 2002 161
6. T. Suzuki, S. Ohtsuka, A. Yamanoue, T. Hosoda, T. Khono, Y. Matuoka, K. Yanai, H. Matsuyama, H. Mori, N. Shimizu, T. Nakamura, S. Sugatani, K. Shono, and H. Yagi IITC 2002 229
7. K.Y.Y. Doong, R.C.J. Wang, S.C. Lin, L.J. Hung, S.Y. Lee, C.C. Chiu, D. Su, K. Wu, K.L. Young, and Y.K. Peng IRPS 2003 156
8. C.J. Zhai, H.W. Yao, P.R. Besser, A. Marathe, R.C. Blish, D. Erb, C. Hau-Riege, S. Taylor, and K.O. Taylor IRPS 2004 234
9. W.C. Baek, P.S. Ho, J.G. Lee, S.B. Hwang, K.K. Choi, and J.S. Maeng R.J. Carter C.S. Hau-Riege G.M. Kloster T.-M. Lu S.E. Schulz Materials, Technology and Reliability for Advanced Interconnects and Low-k Dielectrics-2004 Mater. Res. Soc. Symp. Proc. vol. 812 2004 Materials Research Society Warrendale, Pennsylvania F7.8
10. J.M. Paik, H. Park, Y.C. Joo, and K.C. Park J. Appl. Phys. 97 2005 104513
11. P.R. Besser, Ehrenfried Zschech, Werner Blum, Delrose Winter, Richard Ortega, Strewart Rose, Matt Herrick, Martin Gall, Stacye Thrasher, Mike Tiner, Brett Baker, Greg Braeckelmann, Larry W. Zhao, Cindy Simpson, Cristiano Capasso, Hisao Kawasaki, and Elizabeth Weitzman J. Electron. Mater. 30 2001 320
12. ABAQUS, Version 6.2, General Purpose Finite Element Program 2001 Hibbit, Karlson, and Sorensen, Inc. Pawtucket, RI
13. R.R. Reeber, and K. Wang Mater. Chem. Phys. 46 1996 259
14. K.H. Hellwege A.M. Hellwege Landolt-Bornstein: Numerical Data and Functional Relationships in Science and Technology, Group III: Vol. 1 1966 Springer-Verlag
15. M.B. Bever Encyclopedia of Materials Science and Engineering 1986 Pergamon Press
16. E.A. Brandes G.B. Brook Smithells Metals Reference Book 7th edition 1999 Buttterworth-Heinemann
17. Y.L. Shen, S. Suresh, and I.A. Blech J. Appl. Phys. 80 1996 1388
18. P.H. Townsend Low Dielectric Constant Materials III MRS Symposium Proceedings vol. 476 1997 9
19. W.D. Nix Metall. Trans. 20A 1989 2217
20. J.M. Paik, I.M. Park, K.C. Park, Y.C. Joo, J. Appl. Phys., (in press).
21. J.M. Paik, and Y.C. Joo P.S. Ho S.P. Baker T. Nakamura C.A. Volkert Stress-Induced Phenomena in Metallization: 7th International Workshop 2004 American Institute of Physics NewYork 27
22. W.D. Nix, and E. Arzt Metall. Trans. 23A 1992 2007
23. P.A. Flinn Mater. Res. Bull. 20 11 1995 70
24. Y.L. Shen, Y.I. Guo, and C.A. Minor Acta Mater. 48 2000 1667