Crystal plasticity in Cu damascene interconnect lines undergoing electromigration as revealed by synchrotron x-ray microdiffraction

Applied Physics Letters

Volumn 88, Issue 23, 2006, Pages

  Budiman, A S ^a   Nix, W D ^a   Tamura, N ^b   Valek, B C ^b   Gadre, K ^c   Maiz, J ^c   Spolenak, R ^d   Patel, J R ^a,b  

^a Stanford University   (United States)

^b LAWRENCE BERKELEY NATIONAL LABORATORY   (United States)

^c INTEL CORPORATION   (United States)

^d ETH ZURICH   (Switzerland)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRON FLOW; GRAIN ROTATION; SUBGRAIN STRUCTURES; VOIDS;

COPPER; DISLOCATIONS (CRYSTALS); ELECTROMIGRATION; PLASTIC DEFORMATION; PLASTIC FLOW; X RAY DIFFRACTION ANALYSIS;

OPTICAL INTERCONNECTS;

EID: 33745050126     PISSN: 00036951     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.2210451     Document Type: Article

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