Electromigration failure of contacts and vias in sub-micron integrated circuit metallizations

Microelectronics Reliability

Volumn 36, Issue 7-8 SPEC. ISS., 1996, Pages 925-953

  Oates, Anthony S ^a  

^a LUCENT TECHNOLOGIES   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM; CRYSTAL DEFECTS; CRYSTAL MICROSTRUCTURE; CURRENT DENSITY; ELECTRIC CONTACTS; FAILURE ANALYSIS; INTEGRATED CIRCUITS; METALLIC FILMS; METALLIZING; RELIABILITY; THERMAL EFFECTS;

ELECTROMIGRATION FAILURE; INTERMETAL CONTACTS; METALLIZATION; SUBMICRON INTEGRATED CIRCUITS; VIAS;

ELECTROMIGRATION;

EID: 0030196162     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/0026-2714(96)00102-3     Document Type: Article

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