Stresses in thin films and interconnect lines

Microelectronic Engineering

Volumn 60, Issue 1-2, 2002, Pages 17-29

  Gudmundson, P ^a   Wikstrom A ^a  

^a ROYAL INSTITUTE OF TECHNOLOGY   (Sweden)

Author keywords

Copper; Interconnect lines; Texture; Thermal stress; Thin films

Indexed keywords

COPPER; CRYSTAL MICROSTRUCTURE; MICROELECTRONICS; PLASTICITY; STRESS CONCENTRATION; SUBSTRATES; TEXTURES; THERMAL STRESS; THERMOELASTICITY;

INTERCONNECT LINES;

THIN FILMS;

EID: 0036133245     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0167-9317(01)00577-9     Document Type: Conference Paper

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