Effect of dielectric materials on stress-induced damage modes in damascene Cu lines

Journal of Applied Physics

Volumn 97, Issue 10, 2005, Pages

  Paik, Jong Min ^a   Park, Hyun ^a   Joo, Young Chang ^a   Park, Ki Chul ^b  

^a Seoul National University   (South Korea)

^b SAMSUNG Electronics   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

COEFFICIENT OF THERMAL EXPANSION (CTE); MISES STRESS; PARASITIC CAPACITANCE; STRESS-INDUCED DAMAGE;

COPPER; CROSSTALK; SILICA; STRESS ANALYSIS; THERMAL EXPANSION; X RAY DIFFRACTION ANALYSIS; YIELD STRESS;

DIELECTRIC MATERIALS;

EID: 20944439179     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.1909283     Document Type: Article

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