Measurements of stress during vapor deposition of copper and silver thin films and multilayers

Journal of Applied Physics

Volumn 80, Issue 11, 1996, Pages 6243-6256

  Shull, Alison L ^a,b   Spaepen, Frans ^a  

^a HARVARD UNIVERSITY   (United States)

^b TERADYNE INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0001132577     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.363701     Document Type: Article

References (56)

1. R. C. Cammarata, Prog. Surf. Sci. 46, 1 (1994).
2. J. W. Gibbs, The Scientific Papers of J. Willard Gibbs (Longmans-Green, London, 1906) Vol. I.
3. R. Shuttleworth, Proc. Phys. Soc. London, Sec. A 63, 444 (1950).
4. C. Herring, in The Physics of Powder Metallurgy, edited by W. E. Kingston (McGraw-Hill, New York, 1951) pp. 143.
5. J. W. Cahn, Acta Metall. 28, 1333 (1980).
6. F. Spaepen, J. Mech. Phys. Solids 44, 675 (1996).
7. J. A. Ruud, Ph.D. thesis, Harvard University, 1992.
8. J. A. Ruud, A. Witvrouw, and F. Spaepen, J. Appl. Phys. 74, 2517 (1993).
9. S. Berger and F. Spaepen, Nanostruct. Mater. 6, 201 (1995).
10. In earlier articles (see Refs. 8 and 9), we called a negative interface stress tensile, different from the more common nomenclature, which is adopted here. The common usage corresponds to considering the interface as an infinitely thin membrane under tension or compression.
11. P. Gumbsch and M. S. Daw, Phys. Rev. B 44, 3934 (1991).
12. P. A. Flinn, D. S. Gardner, and W. D. Nix, IEEE Trans. Electron Devices ED-34, 689 (1987).
13. C. A. Volkert, J. Appl. Phys. 70, 3521 (1991).
14. A. L. Shull, Ph.D. thesis, Harvard University, 1996.
15. M. F. Doerner and W. D. Nix, CRC Crit. Rev. Solid State Mater. Sci. 14, 225 (1988).
16. R. Koch, J. Phys., Condens. Matter. 6, 9519 (1994).
17. J. L. Murray, Metall. Trans. A 15A, 261 (1984).
18. S. Nakanishi, K. Kawamoto, and K. Umezawa, Surf. Sci. 287/288, 974 (1993).
19. T. N. Taylor, M. A. Hoffbauer, C. J. Maggiore, and J. G. Beery, J. Vac. Sci. Technol. A 5, 1625 (1986).
20. W. Wallauer and T. Fauster, Surf. Sci. 331-333, 731 (1995).
21. C. T. Horng and R. W. Vook, J. Vac. Sci. Technol. 11, 140 (1974).
22. A. P. Hitchcock, M. D. Crescenzi, and T. Tyliszczak, Physica B 158, 666 (1989).
23. R. Abermann and R. Koch, Thin Solid Films 129, 71 (1985).
24. D. Winau, R. Koch, A. Fuhrmann, and K. H. Rieder, Thin Solid Films 70, 3081 (1991).
25. R. Koch, D. Winau, A. Fuhrmann, and K. H. Rieder, Vacuum 43, 521 (1992).
26. R. Koch, D. Winau, K. Thurmer, M. Weber, and K. H. Rieder, Europhys. Lett. 21, 213 (1993).
27. R. Koch, H. Leonhard, G. Thurner, and R. Abermann, Rev. Sci. Instrum. 61, 3859 (1990).
28. E. Klokholm and B. S. Berry, J. Electrochem. Soc. 115, 823 (1968).
29. R. W. Hoffman, Thin Solid Films 34, 185 (1976).
30. W. D. Nix, DSRC Workshop on Intrinsic Stresses in Thin Films and Layered Structures (unpublished).
31. P. Chaudhari, J. Vac. Sci. Technol. A 9, 520 (1972).
32. R. Abermann, Vacuum 41, 1279 (1990).
33. H. Windischmann, CRC Crit. Rev. Solid State Mater. Sci. 17, 547 (1992).
34. R. Abermann, R. Kramer, and J. Maser, Thin Solid Films 52, 215 (1978).
35. P. H. Townsend, D. M. Barnett, and T. A. Brunner, J. Appl. Phys. 62, 4438 (1987).
36. J. A. Mullin (private communication).
37. A. Witvrouw, Ph.D. thesis, Harvard University, 1992.
38. A. L. Shull, H. G. Zolla, and F. Spaepen, Mater. Res. Soc. Symp. Proc. 356, 345 (1995).
39. J. P. Hirth and J. Lothe, Theory of Dislocations, 2nd ed. (Wiley, New York, 1982).
40. Thermophysical Properties of Matter: Thermal Expansion-Metallic Elements, edited by Y. S. Touloukian (ACS and AIP, West Lafayette, IN, 1974), Vol. 12.
41. Thermophysical Properties of Matter: Thermal Expansion-Nonmetallic Solids, edited by Y. S. Touloukian (ACS and AIP, West Lafayette, IN, 1974), Vol. 13.
42. R. Abermann and R. Koch, Thin Solid Films 142, 65 (1986).
43. W. Wulfhekel, N. N. Lipkin, J. Kliewer, G. Rosenfeld, L. C. Jorritsma, B. Poelsema, and G. Comsa, Surf. Sci. 348, 227 (1996).
44. G. Thurner and R. Abermann, Thin Solid Films 192, 277 (1990).
45. D. Ghaleb and B. Perraillon, Surf. Sci. 162, 103 (1985).
46. J. J. de Miguel, A. Cebollada, J. M. Gallego, J. Ferron, and S. Ferrer, J. Cryst. Growth 88, 422 (1988).
47. C. V. Thompson and R. Carel, Mater. Sci. Eng. B 32, 211 (1995).
48. In an earlier report (see Ref. 38) we presented F/w data for a continuously deposited Cu/Ag multilayer that did not clearly exhibit the tensile maximum for the Ag layers. The resolution of the data is less than that in the present article. Also, all layers (especially the first layer) in the early report are thinner than the ones used here, as a result of which the coverage may have been incomplete. Note, however, that the results for thicker trilayers reported in the earlier article are entirely consistent with the present observations.
49. T. Ueda, G. F. Simenson, W. D. Nix, and B. M. Clemens, Mater. Res. Soc. Symp. Proc. 382, 279 (1995).
50. C. M. Su and M. Wuttig, Appl. Phys. Lett. 63, 3437 (1993).
51. J. F. Nye, Physical Properties of Crystals: Their representation by tensors and matrices (Claredon, Oxford, 1985).
52. The Voigt average of the biaxial modulus was computed from the Voigt average of the Lamé constants.
53. Powder Diffraction File, edited by W. F. McClune (International Centre for Diffraction Data, Swarthmore, PA, 1990).
54. H. Huang and F. Spaepen (to be published).
55. D. Heinen, H. G. Bohn, and W. Schilling, J. Appl. Phys. 77, 3742 (1995).
56. H. Huang and F. Spaepen, Mater. Res. Soc. Symp. Proc. 405, 501 (1996).