Failure morphology after drop impact test of ball grid array (BGA) package with lead-free Sn-3.8Ag-0.7Cu and eutectic SnPb solders

IEEE Transactions on Electronics Packaging Manufacturing

Volumn 30, Issue 1, 2007, Pages 49-53

  Jang, Jin Wook ^a   De Silva, Ananda P ^a   Drye, James E ^a   Post, Steve L ^a   Owens, Norman L ^a   Lin, Jong Kai ^a   Frear, Darrel R ^a  

^a FREESCALE SEMICONDUCTOR INC   (United States)

Author keywords

Packaging; Reliability; Sn alloy; Soldering

Indexed keywords

DEFORMATION; EUTECTICS; FAILURE ANALYSIS; IMPACT TESTING; MORPHOLOGY; STRAIN RATE; TIN ALLOYS;

DROP IMPACT TEST; SOLDER BALLS; UNDER BUMP METALLIZATION;

BALL GRID ARRAYS;

EID: 34047106690     PISSN: 1521334X     EISSN: None     Source Type: Journal    
DOI: 10.1109/TEPM.2006.890643     Document Type: Article

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