Deformation characteristics of tin-based solder joints

Journal of Materials Research

Volumn 18, Issue 10, 2003, Pages 2304-2309

  Antoniou, Antonia ^a   Bastawros, Ashraf F ^a  

^a Iowa State University of Science and Technology   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CONTINUUM MECHANICS; DEFORMATION; ELECTRONICS PACKAGING; GRAIN SIZE AND SHAPE; MICROELECTRONICS; TIN; TOUGHNESS;

DEFORMATION FIELDS;

SOLDERED JOINTS;

EID: 0242576012     PISSN: 08842914     EISSN: None     Source Type: Journal    
DOI: 10.1557/JMR.2003.0323     Document Type: Article

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