Constitutive response of passivated copper films to thermal cycling

Journal of Applied Physics

Volumn 93, Issue 3, 2003, Pages 1806-1812

  Shen, Y L ^a   Ramamurty, U ^b  

^a University of New Mexico   (United States)

^b INDIAN INSTITUTE OF SCIENCE   (India)

Author keywords

[No Author keywords available]

Indexed keywords

COOLING; COPPER; HEATING; PASSIVATION; PLASTICITY; QUARTZ; SILICON; STRAIN HARDENING; STRESS RELAXATION; THERMAL CYCLING; THERMAL LOAD;

CURVATURE METHOD;

THIN FILMS;

EID: 0037320159     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.1535731     Document Type: Article

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