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Journal of Materials Research

Volumn 15, Issue 8, 2000, Pages 1797-1802

The effects of the mechanical properties of the confinement material on electromigration in metallic interconnects

(2) Hau Riege, Stefan P a,b Thompson, Carl V a

a Massachusetts Institute of Technology Cambridge (United States)

b INTEL CORPORATION (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CRYSTAL LATTICES; DIELECTRIC MATERIALS; ELASTIC MODULI; FINITE ELEMENT METHOD; INTEGRATED CIRCUITS; METALLIZING; PERMITTIVITY; STRAIN; STRESSES;

METALLIC INTERCONNECTS;

ELECTROMIGRATION;

EID: 0034256167 PISSN: 08842914 EISSN: None Source Type: Journal
DOI: 10.1557/JMR.2000.0259 Document Type: Article

Times cited : (65)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.