Influence of W via on the mechanism of electromigration failure in Al-0.5 Cu interconnects

Applied Physics Letters

Volumn 72, Issue 22, 1998, Pages 2814-2816

  Le, H A ^a   Tso, N C ^a   Rost, T A ^a   Kim, C U ^b  

^a TEXAS INSTRUMENTS   (United States)

^b University of Texas at Arlington   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0003179472     PISSN: 00036951     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.121467     Document Type: Article

References (14)

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