Thermal cycle reliability of stacked via structures with copper metallization and an organic low-k dielectric

Annual Proceedings - Reliability Physics (Symposium)

Volumn , Issue , 2004, Pages 61-67

  Filippi, R G ^a   McGrath, J F ^a   Shaw, T M ^b   Murray, C E ^b   Rathore, H S ^a   McLaughlin, P S ^a   McGahay, V ^a   Nicholson, L ^a   Wang, P C ^a   Lloyd, J R ^b   Lane, M ^b   Rosenberg, R ^b   Liu, X ^b   Wang, Y Y ^a   Landers, W ^a   Spooner, T ^a   Demarest, J J ^a   Engel, B H ^a   Gill, J ^a   Goth, G ^a   Barth, E ^a   Biery, G ^b   Davis, C R ^a   Wachnik, R A ^a   Goldblatt, R ^b   Ivers, T ^a   Swinton, A ^a   Barile, C ^a   Aitken, J ^a   more..

^a IBM MICROELECTRONICS   (United States)

^b IBM T J WATSON RESEARCH CENTER   (United States)

Author keywords

Fatigue; Mechanical integrity; Thermal cycle

Indexed keywords

BIMODAL LOGNORMAL FAILURE DISTRIBUTIONS; MECHANICAL INTEGRITY; ROOM TEMPERATURE; SPECIFIC LINEAR PROCESSES;

COPPER; CRACKS; DIFFUSION; DOPING (ADDITIVES); METALLIZING; METALS; PERMITTIVITY; STATISTICAL METHODS; THERMAL CYCLING; THERMAL EFFECTS; THERMAL EXPANSION; THERMOCOUPLES; THERMODYNAMIC PROPERTIES; TRANSMISSION ELECTRON MICROSCOPY;

DIELECTRIC MATERIALS;

EID: 3042557819     PISSN: 00999512     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (15)

1. S. J. Martin, et al., Adv. Mater. Vol. 12, pp. 1769-1778, 2000.
2. D. Edelstein, et al., IITC 2001, Proceedings of the IEEE International Interconnect Technology Conference, Burlingame, CA, June, pp. 9-11.
3. V. McGahay, et al., in Proceedings of the Advanced Metallization Conference 2001, Materials Research Society, pp. 3-9.
4. F. Chen, B. Li, T. D. Sullivan, C. L. Gonzalez, C. D. Muzzy, H. K. Lee, M. D. Levy, M. W. Dashiell, J. Kolodzey, J. Vac. Sci. Technol. B Vol. 18, pp. 2826-2834, 2000.
5. M. F. Ashby, D. R. H. Jones, Engineering Materials, International Series on Materials Science and Technology, Vol. 34, Cambridge, England, Pergamon International Library, 1980, pp. 135-142.
6. th Electronic Components Conference, 1977, pp. 25-29.
7. R. T. Howard, IBM J. Res. Dev. Vol. 26, pp. 372-378, 1982.
8. th Annual Proceedings of Reliability Physics, Dallas, 2002, (IEEE, New York, 2002), pp. 298-304.
9. C.-K. Hu, L. Gignac, E. Liniger, R. Rosenberg, A. Stamper, IITC 2002, Proceedings of the IEEE International Interconnect Technology Conference, Burlingame, CA, June, pp. 133-135.
10. K. C. Norris, A. H. Landberg, IBM J. Res. Dev. Vol. 13, pp. 266-271, 1969.
11. R. Schwaiger, G. Dehm, O. Kraft, Philos. Mag. Vol. 83, pp.693-710, 2003.
12. th Annual Proceedings of Reliability Physics, San Diego, 1992 (IEEE, New York, 1992), pp. 268-275.
13. C. H. Stapper, IBM J. Res. Dev. Vol. 27, pp. 549-557, 1983.
14. nd Annual Proceedings of Reliability Physics, Phoenix, 2004 (IEEE, New York, 2004).
15. H. V. Nguyen, C. Salm, J. Vroemen, J. Voets, B. Krabbenborg, J. Bisschop, A. J. Mouthaan, F. G. Kuper, Microelectronics Reliability Vol. 42, pp. 1415-1420, 2002.