Size-independent stresses in Al thin films thermally strained down to -100 °C

Acta Materialia

Volumn 55, Issue 6, 2007, Pages 1941-1946

  Eiper, E ^a   Keckes, J ^a,b   Martinschitz, K J ^a   Zizak, I ^c   Cabie M ^a,d   Dehm, G ^a,b  

^a Erich Schmid Institute of Materials Science   (Austria)

^b UNIVERSITY OF LEOBEN   (Austria)

^c HAHN MEITNER INSTITUT   (Germany)

^d CEMES CNRS   (France)

Author keywords

Flow stress; Low temperature; Stress plateau; Thin film; X ray diffraction

Indexed keywords

ALUMINUM; IN SITU PROCESSING; LOW TEMPERATURE EFFECTS; PLASTIC FLOW; STRAIN; THERMAL CYCLING; THERMAL EFFECTS; X RAY DIFFRACTION;

COMPRESSIVE STRESSES; IN PLANE STRESSES; STRESS PLATEAU; STRESS TEMPERATURE EVOLUTIONS;

THIN FILMS;

EID: 33847357374     PISSN: 13596454     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.actamat.2006.10.052     Document Type: Article

References (35)

1. Nix W.D. Scripta Mater 39 (1998) 545
2. Kraft O., Freund L.B., Phillips R., and Arzt E. MRS Bull 27 1 (2002) 30
3. Sanchez Jr. J.E., and Arzt E. Scripta Met et Mater 27 3 (1992) 285
4. Freund L.B. Adv Appl Mech 30 (1994) 1
5. Venkatraman R., Bravman J.C., Nix W.D., Davies P.W., Flinn P.A., and Fraser D.B. J Electr Mater 19 (1990) 1231
6. Dehm G., Balk T.J., Edongue H., and Arzt E. Microelectr Eng 70 (2003) 412
7. von Blanckenhagen B., Arzt E., and Gumbsch P. Acta Mat 52 (2004) 773
8. Gao H., Zhang L., Nix W.D., Thompson C.V., and Arzt E. Acta Mat 47 (1999) 2865
9. Kobrinsky M.J., and Thompson C.V. Appl Phys Let 73 17 (1998) 2429
10. Weiss D., Gao H., and Arzt E. Acta Mat 49 (2001) 2395
11. Gibbs G.B. Phil Mag 13 (1966) 589
12. Kobrinsky M.J., Dehm G., Thompson C.V., and Arzt E. Acta Mat 49 (2001) 3597
13. Schmidt T.K., Balk T.J., Dehm G., and Arzt E. Scripta Mat 50 (2004) 733
14. Balk T.J., Dehm G., and Arzt E. Acta Mat 51 (2003) 4471
15. Wiederhirn G, Arzt E. Private communication, 2006.
16. Dehm G., Inkson B.J., Wagner T., Balk T.J., and Arzt E. J Mater Sci Techn 18 2 (2002) 113
17. www.anton-paar.com.
18. 2ψ-Verfahren der röntgenographischen Spannungsmessung. Zeitschrift für Physik 13 (1961) 305
19. Keckes J., Hafok M., Eiper E., Hofer A., Resel R., and Eisenmenger-Sittner C. Powder Diff 19 4 (2004) 367
20. Noyan I.C., and Cohen J.B. Residual stress, measurement by diffraction and interpretation 1987 (1987), Springer, Berlin
21. van Houtte P., and de Buyser L. Acta Mat 41 (1993) 323
22. Dölle H. J Appl Cryst 12 (1979) 489
23. Keckes J. J Appl Cryst 38 (2005) 311
24. Segmüller A., Noyan I.C., and Speriosu V.S. Prog Cryst Growth Char Mater 18 (1989) 21
25. Kraft O., Hommel M., and Arzt E. Mat Sci Eng A288 (2000) 209
26. Freund L.B., and Suresh S. Thin Film Materials (2003), Cambridge University Press, Cambridge 171
27. Sutton P.M. Phys Rev 91 4 (1953) 816
28. Stoney G.G. Proc Roy Soc London A 82 (1909) 172
29. Shen Y.L., and Suresh S. J Mater Res 13 (1998) 1928
30. Baker S.P., Keller-Flaig R.M., and Shu J.B. Acta Mat 51 10 (2003) 3019
31. Xiang Y, Vlassak JJ. Acta Mat, in press.
32. Xiang Y., and Vlassak J.J. Scripta Mat 53 (2005) 177
33. Venkartaman R. Plasticity and flow stresses in aluminium thin films on silicon 1992. PhD Thesis: Stanford University.
34. Vinci R.P., Forrest S.A., and Bravman J.C. J Mater Res 17 7 (2002) 1863
35. Chaudhari C. J Appl Phys 45 (1974) 4339