On the formation of voids in thin-film metal interconnects

Scripta Materialia

Volumn 37, Issue 11, 1997, Pages 1805-1810

  Shen, Y L ^a  

^a University of New Mexico   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING; CRYSTALLOGRAPHY; DISLOCATIONS (CRYSTALS); INTERFACES (MATERIALS); MATHEMATICAL MODELS; NUCLEATION; NUMERICAL ANALYSIS; SHEAR STRESS; STRESS ANALYSIS; THIN FILMS;

CRYSTALLOGRAPHIC SLIP; DISLOCATION SLIP MODEL; THIN FILM METAL INTERCONNECTS;

METALLIC FILMS;

EID: 0031381892     PISSN: 13596462     EISSN: None     Source Type: Journal    
DOI: 10.1016/S1359-6462(97)00342-4     Document Type: Article

References (8)

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2. T.D. Sullivan, Annu. Rev. Mater. Sci. 26, 333 (1996).
3. P.A. Flinn, MRS Bull. 20(11), 70 (1995).
4. R.J. Gleixner, B.M. Clemens and W.D. Nix, J. Mater. Res., in press.
5. Y.-L. Shen, submitted to IEEE Trans. Comp., Packag., Manufact. Technol., Part A.
6. C.A. Volkert, C.F. Alofs and J.R. Liefting, J. Mater. Res. 9, 1147 (1994).
7. M.D. Thouless, K.P. Rodbell and C. Cabral, Jr., J. Vac. Sci. Technol. A 14, 2454 (1996).
8. Y.-L. Shen and S. Suresh, in Polycrystalline Thin Films - Structure, Texture, Properties, and Applications II, p. 133 (Mater. Res. Soc. Symp. Proc., Vol. 403, 1996).