Thermomechanical stress analysis of Cu/low-k dielectric interconnect schemes

Microelectronics Reliability

Volumn 41, Issue 9-10, 2001, Pages 1637-1641

  Mathewson, Alan ^a   Montes De Oca, Carlos Gonzales ^a   Foley, Sean ^b  

^a UNIVERSITY COLLEGE CORK   (Ireland)

^b Cypress Semiconductors   (Ireland)

Author keywords

[No Author keywords available]

Indexed keywords

CAPACITANCE; COMPUTER SIMULATION; INTEGRATED CIRCUITS; INTERCONNECTION NETWORKS; INTERFACES (MATERIALS); PERMITTIVITY; STRESS ANALYSIS; STRESS CONCENTRATION;

THERMOMECHANICAL STRESSES;

DIELECTRIC DEVICES;

EID: 18044379130     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0026-2714(01)00160-3     Document Type: Article

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