Micromechanical modelling of SnAgCu solder joint under cyclic loading: Effect of grain orientation

Computational Materials Science

Volumn 39, Issue 1 SPEC. ISS., 2007, Pages 187-197

  Gong, Jicheng ^a   Liu, Changqing ^a   Conway, Paul P ^a   Silberschmidt, Vadim V ^a  

^a LOUGHBOROUGH UNIVERSITY   (United Kingdom)

Author keywords

Crystal visco plasticity; Finite elements; Flip chip; SnAgCu solder; Sub model

Indexed keywords

COMPOSITE MICROMECHANICS; CYCLIC LOADS; GRAIN BOUNDARIES; MOLECULAR ORIENTATION; TIN COMPOUNDS; VISCOPLASTICITY;

CRYSTAL VISCOPLASTICITY; FLIP CHIP; SUB-MODEL;

SOLDERED JOINTS;

EID: 33846565378     PISSN: 09270256     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.commatsci.2006.02.020     Document Type: Article

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