Effects of thermomechanical cycling on lead and lead-free (SnPb and SnAgCu) surface mount solder joints

Microelectronics Reliability

Volumn 41, Issue 11, 2001, Pages 1815-1822

  Stam, F A ^a   Davitt, E ^a  

^a UNIVERSITY COLLEGE CORK   (Ireland)

Author keywords

[No Author keywords available]

Indexed keywords

EUTECTICS; GRAIN BOUNDARIES; INTERFACES (MATERIALS); LEAD ALLOYS; MICROSTRUCTURE; SURFACE MOUNT TECHNOLOGY; THERMOMECHANICAL TREATMENT;

TERNARY EUTECTIC SOLDER ALLOYS;

SOLDERED JOINTS;

EID: 0035501302     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0026-2714(01)00087-7     Document Type: Article

References (9)

1. IDEALS - Improved design life and environmentally aware manufacturing of electronics assemblies by lead-free soldering
2. Pb-free solders based on SnAgCu, SnAgBi, SnAg and SnCu, for wave soldering of electronic assemblies
3. Thermal conductivity and specific heat determinations of a set of lead-free solder alloys
4. Design for reliability for surface mount solder attachments: Physics of failure and statistical failure distributions
5. Can power cycling life of solder joint interconnections be assessed on the basis of temperature cycling tests?
6. A design tool for evaluating low cycle solder fatigue of SMT interconnection
7. Effect of solid-state intermetallic growth on the fracture toughness of Cu/63Sn-37Pb solder joints
8. The role of intermetallic compounds in lead-free soldering