Influence of tantalum and silver interlayers on thermal stress evolution in copper thin films on silicon substrates

Scripta Materialia

Volumn 50, Issue 6, 2004, Pages 733-737

  Schmidt, T K ^a   Balk, T J ^a   Dehm, G ^a   Arzt, E ^a  

^a MAX PLANCK INSTITUTE FOR INTELLIGENT SYSTEMS   (Germany)

Author keywords

Copper; Interlayers; Mechanical properties; Multilayers; Thin Films

Indexed keywords

ADHESION; COMPRESSIVE STRESS; COPPER; GRAIN BOUNDARIES; HEAT TREATMENT; INTERFACES (MATERIALS); MAGNETIC RECORDING; MICROELECTROMECHANICAL DEVICES; PASSIVATION; SILICON; SILVER; STRESS RELAXATION; TANTALUM; THERMAL CYCLING; THERMAL STRESS;

INTERDIFFUSION; INTERLAYERS;

THIN FILMS;

EID: 0346499164     PISSN: 13596462     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.scriptamat.2003.11.039     Document Type: Article

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