Mechanical deflection system (MDS) test and methodology for PBGA solder joint reliability

IEEE Transactions on Advanced Packaging

Volumn 24, Issue 4, 2001, Pages 507-514

  Pang, John H L ^a   Ang, Kar Hwee ^b   Shi, Xunquig Q ^b   Wang, Z P ^b  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

^b SINGAPORE INSTITUTE OF MANUFACTURING TECHNOLOGY   (Singapore)

Author keywords

Fatigue; Reliability; Solder joint; Thermal cycling

Indexed keywords

ACCELERATED THERMAL CYCLING; CYCLIC TWISTING DEFORMATION; FINITE ELEMENT MODELLING; ISOTHERMAL CONDITION; MECHANICAL DEFLECTION SYSTEM TEST; SOLDER JOINT RELIABILITY; THERMAL SHOCK TEST;

ASSEMBLY; DEFORMATION; ELECTRONICS PACKAGING; FAILURE (MECHANICAL); FATIGUE OF MATERIALS; FINITE ELEMENT METHOD; MATHEMATICAL MODELS; OPTIMIZATION; PRINTED CIRCUIT BOARDS; RELIABILITY; SURFACE MOUNT TECHNOLOGY; THERMAL CYCLING;

SOLDERED JOINTS;

EID: 0035521191     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/6040.982837     Document Type: Article

References (9)

1. Fatigue life estimation of surface mount solder joints
2. Mechanical deflection system-an innovative test method for SMT assemblies
3. Reliability test methodology using thermo-mechanical deflection
4. Effects of temperature and strain rate on mechanical properties of 63Sn/37Pb solder alloy
5. A modified energy-based low cycle fatigue model for eutectic solder alloy
6. Solder joint fatigue model