Lead-free solders in microelectronics

Materials Science and Engineering R: Reports

Volumn 27, Issue 5, 2000, Pages 95-141

  Abtew, Mulugeta ^a   Selvaduray, Guna ^b  

^a SCI Systems   (United States)

^b SAN JOSE STATE UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS PACKAGING; ENCAPSULATION; FATIGUE OF MATERIALS; INTEGRATED CIRCUIT MANUFACTURE; MICROELECTRONICS; MICROPROCESSOR CHIPS; OXIDATION RESISTANCE; PLASTICS APPLICATIONS; STRENGTH OF MATERIALS; SURFACE MOUNT TECHNOLOGY; THERMAL EXPANSION; WETTING;

LEAD-FREE SOLDERS;

SOLDERING ALLOYS;

EID: 0033747819     PISSN: 0927796X     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0927-796X(00)00010-3     Document Type: Article

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