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Microelectronics Reliability

Volumn 44, Issue 2, 2004, Pages 195-205

An introduction to Cu electromigration

(1) Hau Riege, Christine S a

a ADVANCED MICRO DEVICES (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CAPACITANCE; CHEMICAL BONDS; COMPUTATIONAL GEOMETRY; COPPER; CURRENT DENSITY; DIELECTRIC MATERIALS; DIFFUSION; ELECTRIC FIELDS; ELECTRIC POWER SYSTEM INTERCONNECTION; ELECTRIC RESISTANCE; EXTRAPOLATION; HIGH TEMPERATURE EFFECTS; MELTING; RELIABILITY; ROBUSTNESS (CONTROL SYSTEMS);

INTERLEVEL DIELECTRIC (ILD); METAL CAPS;

ELECTROMIGRATION;

EID: 0942277277 PISSN: 00262714 EISSN: None Source Type: Journal
DOI: 10.1016/j.microrel.2003.10.020 Document Type: Article

Times cited : (208)

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