Numerical simulations and experimental measurements of stress relaxation by interface diffusion in a patterned copper interconnect structure

Journal of Applied Physics

Volumn 97, Issue 1, 2005, Pages

  Singh, N ^a   Bower, A F ^a   Gan, D ^b   Yoon, S ^b   Ho, P S ^b   Leu, J ^c   Shankar, S ^c  

^a Brown University   (United States)

^b UNIVERSITY OF TEXAS AT AUSTIN   (United States)

^c INTEL CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

FLUX DIVERGENCES; INTERCONNECT STRUCTURE; INTERFACE DIFFUSION; MASS TRANSPORT;

COMPUTER SIMULATION; DIFFUSION; ELECTROMIGRATION; FINITE ELEMENT METHOD; INTERFACES (MATERIALS); OPTICAL INTERCONNECTS; PASSIVATION; PERMITTIVITY; STRESS RELAXATION;

COPPER;

EID: 19944432776     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.1829372     Document Type: Article

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