The aging of metallic thin films delamination, strain relaxation, and diffusion

JOM

Volumn 59, Issue 9, 2007, Pages 50-53

  Kennedy, M S ^a   Moody, N R ^b   Bahr, D F ^a  

^a WASHINGTON STATE UNIVERSITY   (United States)

^b SANDIA NATIONAL LABORATORIES   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

FRACTURE FIXATION; GOLD; LITHOGRAPHY; MICROELECTROMECHANICAL DEVICES; MICROELECTRONICS; NONMETALS; RELIABILITY; SEMICONDUCTOR DOPING; SILICON; STRAIN CONTROL; STRAIN RELAXATION; THIN FILMS; VAPOR DEPOSITION;

ADHESION ENERGIES; GOLD THIN FILMS; MECHANICAL INTEGRITY (MI); METALLIC THIN FILMS; MICRO-ELECTRO- MECHANICAL SYSTEM (MEMS); SILICON (111) SUBSTRATES; THIN FILM SYSTEMS;

THICK FILMS;

EID: 44749087384     PISSN: 10474838     EISSN: 15431851     Source Type: Journal    
DOI: 10.1007/s11837-007-0117-1     Document Type: Article

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