Designing test interconnect structures for micro-scale stress measurement: An analytical guidance

Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures

Volumn 17, Issue 2, 1999, Pages 448-454

  Shen, Y L ^a  

^a University of New Mexico   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 22644448375     PISSN: 10711023     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.590574     Document Type: Article

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