Influence of frequency on low cycle fatigue behavior of Pb-free solder 96.5Sn-3.5Ag

Materials Science and Engineering: A

Volumn 345, Issue 1-2, 2003, Pages 90-98

  Kanchanomai, C ^a   Miyashita, Y ^a   Mutoh, Y ^a   Mannan, S L ^b  

^a NAGAOKA UNIVERSITY OF TECHNOLOGY   (Japan)

^b INDIRA GANDHI CENTRE FOR ATOMIC RESEARCH   (India)

Author keywords

96.5Sn 3.5Ag; Crack initiation; Crack propagation; Dendrite; Lead free solder materials; Low cycle fatigue; Subgrain

Indexed keywords

CRACK PROPAGATION; DUCTILITY; EUTECTICS; FATIGUE TESTING; MICROCRACKS; SILVER ALLOYS;

LOW CYCLE FATIGUE TESTS;

SOLDERING ALLOYS;

CRACK INITIATION; CRACK PROPAGATION; EUTECTIC ALLOY; FATIGUE; SOLDER; TIN ALLOY;

EID: 0037465953     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0921-5093(02)00461-6     Document Type: Article

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