Stress evolution in passivated thin films of Cu on silica substrates

Journal of Materials Research

Volumn 13, Issue 7, 1998, Pages 1928-1937

  Shen, Y L ^a,d   Suresh, S ^a   He, M Y ^b   Bagchi, A ^b   Kienzle, O ^c   Ruhle M ^c   Evans, A G ^b  

^a MASSACHUSETTS INSTITUTE OF TECHNOLOGY   (United States)

^b HARVARD UNIVERSITY   (United States)

^c MAX PLANCK INSTITUTE FOR INTELLIGENT SYSTEMS   (Germany)

^d University of New Mexico   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; PASSIVATION; SHEAR DEFORMATION; SILICA; STRAIN HARDENING; SUBSTRATES; THERMAL CYCLING; THIN FILMS; TRANSMISSION ELECTRON MICROSCOPY; YIELD STRESS;

STRESS EVOLUTION;

METALLIC FILMS;

EID: 0032124053     PISSN: 08842914     EISSN: None     Source Type: Journal    
DOI: 10.1557/JMR.1998.0272     Document Type: Article

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