Reliability challenges for copper low-k dielectrics and copper diffusion barriers

Microelectronics Reliability

Volumn 45, Issue 9-11, 2005, Pages 1436-1442

  Tokei Zs ^a   Li, Y L ^a,b   Beyer, G P ^a  

^a IEMC Vzw   (Belgium)

^b UNIVERSITY OF LEUVEN   (Belgium)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; LEAKAGE CURRENTS; MESOPOROUS MATERIALS; MICROPOROUS MATERIALS; RELIABILITY;

COPPER DIFFUSION; DAMASCENE; DIELECTRIC DAMAGE; TIME DEPENDENT DIELECTRIC BREAKDOWN (TDDB);

DIELECTRIC MATERIALS;

EID: 24144471091     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2005.07.040     Document Type: Conference Paper

References (22)

1. J. Van Olmen Proc IITC 2003 171 174
2. C. Hong Microel Rel 44 2004 1867 1871
3. Zs. Tokei Microel Eng 2003 352
4. Li Y-L. et al., submitted to ESREF (2005)
5. D. Gupta Mat Chem Anal 41 1995 199 205
6. K. Holloway, P.M. Fryer, C. Cabral Jr., J.M.E. Harper, P.J. Bailey, and K.H. Kelleher J Appl Phys 71 1992 5433
7. A.Z. Moshfegh, and O. Akhavan Mat Sci in Semiconductor Processing 6 2003 165 170
8. S.M. Rossnagel J Vac Sci Technol B 20 6 2002 2328 2336
9. S.M. Rossnagel, and H. Kim J Vac Sci Technol B 21 6 2003 2550 2554
10. I. Kaur, Yu. Mishin, and W. Gust Fundamentals of Grain and Interphase Boundary Diffusion 1995 John Wiley & Sons
11. J. Noguchi, N. Ohashi, J. Yashuda, H. Yamaguchi, N. Owada, and K. Takeda Proc IRPS 2000 339
12. J. Noguchi, T. Saito, N. Ohashi, H. Ashihara, H. Maruyama, and M. Kubo Proc IRPS 2001 355
13. K.Y. Yiang, W.J. Yoo, A. Kishnamoorthy, and L.J. Tang Proc IRPS 2005 490 493
14. Zs. Tokei, J. Van Aelst, C. Waldfried, O. Escoria, P. Rousseel, and O. Richard Proc IRPS 2005 495 500
15. Tokei Zs...., Microel. Eng....
16. Tokei Zs.... AMC2004.
17. Tokei Zs....IRPS2005.
18. Travaly Y. et al., submitted to AMC 2005.
19. G.S. Haase, E.T. Ogawa, and J.W. McPhearson Proc IRPS 2005 466 467 pseudo breakdown and barrier integrity
20. Z. Chen, K. Parasad, N. Jiang, L.J. Tang, N. Babu, and S. Balakumar Proc IRPS 2005 478 482 impact of buried capping layer; top and barrier interface
21. F. Chen Proc IRPS 2005 501 507
22. D. Edelstein Proc IRPS 2004 316 319