Cyclic deformation of polycrystalline Cu films

Philosophical Magazine

Volumn 83, Issue 6, 2003, Pages 693-710

  Schwaiger, R ^a,b   Dehm, G ^a   Kraft, O ^a,c  

^a MAX PLANCK INSTITUTE FOR INTELLIGENT SYSTEMS   (Germany)

^b MASSACHUSETTS INSTITUTE OF TECHNOLOGY   (United States)

^c KARLSRUHE INSTITUTE OF TECHNOLOGY   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; DEFORMATION; DISLOCATIONS (CRYSTALS); FATIGUE OF MATERIALS; NUCLEATION; POLYCRYSTALLINE MATERIALS; POLYIMIDES; TRANSMISSION ELECTRON MICROSCOPY;

FATIGUE DAMAGE;

THIN FILMS;

EID: 0242366180     PISSN: 14786435     EISSN: None     Source Type: Journal    
DOI: 10.1080/0141861021000056690     Document Type: Article

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