Electromigration: A review

Microelectronics Reliability

Volumn 37, Issue 7 SPEC. ISS., 1997, Pages 1053-1072

  Pierce, D G ^a,c   Brusius, P G ^b  

^a SANDIA NATIONAL LABORATORIES   (United States)

^b HONEYWELL TECHNOLOGY CENTER   (United States)

^c Sandia Technologies Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CURRENT DENSITY; INTEGRATED CIRCUIT LAYOUT; INTEGRATED CIRCUIT MANUFACTURE; PROCESS CONTROL; RELIABILITY; WAVEFORM ANALYSIS;

METAL STRIPE GEOMETRY;

ELECTROMIGRATION;

EID: 0031188354     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/s0026-2714(96)00268-5     Document Type: Review

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