Effect of microstructure size on deformation kinetics and thermo-mechanical fatigue of 63Sn37PB solder joints

Journal of Electronic Packaging, Transactions of the ASME

Volumn 118, Issue 2, 1996, Pages 49-54

  Guo, Zhenfeng ^a   Conrad, Hans ^a  

^a North Carolina State University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COOLING; CRACK PROPAGATION; CREEP; EUTECTICS; FATIGUE OF MATERIALS; KINETIC THEORY; LEAD ALLOYS; METALLOGRAPHIC MICROSTRUCTURE; PLASTIC DEFORMATION; STRESSES; TIN ALLOYS;

BOUNDARY SLIDING; COOLING RATE; CREEP RATE; DENDRITES; MICROSTRUCTURE SIZE;

SOLDERED JOINTS;

EID: 0030167811     PISSN: 10437398     EISSN: 15289044     Source Type: Journal    
DOI: 10.1115/1.2792131     Document Type: Article

References (11)

1. Guo, Z., and Conrad, H., “Computer Modeling of Isothermal Low-Cycle Fatigue of Pb-Sn Solder Joints,” Proc. 43rd Electronics Components Tech. Conf., ECTC, CHMT IEEE, Buena Vista Palance, Orlando FL, June 1-4, 1993, pp. 831-838.
2. Guo, Z., and Conrad, H., “Fatigue Cracking Kinetics and Lifetime Prediction of Electronic Solder Joints,” Proc. ASME/JSME/IEEE InterPack’95, Westin Maui, Hawaii, March 26-30, Advances in Electronic Packages, ASME, EEP, V.10-2, 1995, NY, pp. 1129-1141.
3. Bae, K., Guo, Z., Sprecher, A. F., Jung, D., and Conrad, H., “Effect of Compliance on the Fatigue of Solder Joints in Surface-Mounted Electronic Packages,” Proc. Int. Symp. Test. Failure Analysis, ISTFA, 1988, ASM, Metals Park, OH, pp. 53-61.
4. Guo, Z., and Conrad, H., “Fatigue Crack Growth Rate in 63Sn37Pb Solder Joints,” ASME Journal of Electronic Packaging, Vol. 115, June 1993, pp. 159-164.
5. Hacke, P. L., Sprecher, A. F., and Conrad, H., “Thermomechanical Fatigue of 63Sn-37Pb Solder Joints,” Thermal Stress and Strain in Microelectronics Packaging, ed., J. H. Lau, Van Nostrand Reinhold, New York, 1993, pp. 467-499.
6. Guo, Z., Sprecher, A. F., and Conrad, H., “Plastic Deformation Kinetics of Eutectic Pb-Sn Solder Joints in Monotonie Loading and Low-Cycle Fatigue,” ASME Journal of Electronic Packaging, Vol. 114, June 1992, pp. 112-117.
7. Solomon, H. D., “Creep, Strain Rate Sensitivity and Low-Cycle Fatigue of 60/40 Solder,” Brazing and Soldering, No. 11 Autumn 1986, pp. 68-75.
8. Askill, J., Tracer Diffusion Data, Plenum, New York, N.Y., 1970.
9. Guo, Z., Sprecher, A. F., and Conrad, H., “Effect of Sn Content on Crack Growth Rate in Low Cycle Fatigue of Pb-Sn Solder Joints,” Proc. ASM 5th Electronic Packaging Congress: Materials and Processes to Reduce Package Cycle Time and Improve Reliability, Cambridge, MA, Aug. 24-27, 1992, pp. 209-216.
10. Shine, M. C., and Fox, L. R., “Fatigue of Solder Joints in Surface Mount Devices,” Low Cycle Fatigue, ASTM STP 942, ed. by H. D. Solomon, ASTM, Philadelphia, 1988, pp. 588-610.
11. Knecht, S., and Fox, L., “Integrated Matrix Creep Application to Accelerated Testing and Lifetime Prediction,” Solder Joints Reliability-Theory and Application, ed. by L. H. Lau, Van Nostrand Reinhold, New York, 1991, pp. 508-544.