Voiding induced stress redistribution and its reliability implications in metal interconnects

Acta Materialia

Volumn 48, Issue 8, 2000, Pages 1667-1678

  Shen, Y L ^a   Guo, Y L ^a   Minor, C A ^a  

^a University of New Mexico   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; ELECTROMIGRATION; FINITE DIFFERENCE METHOD; FINITE ELEMENT METHOD; INTEGRATED CIRCUITS; MATHEMATICAL MODELS; RELIABILITY; STRESS ANALYSIS; STRESS CONCENTRATION; STRESS RELAXATION; THERMAL STRESS; THIN FILMS;

MICRODIFFRACTION; STRESS REDISTRIBUTION; VOIDING;

ALUMINUM;

EID: 0343777268     PISSN: 13596454     EISSN: None     Source Type: Journal    
DOI: 10.1016/S1359-6454(00)00008-2     Document Type: Article

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