Thermal cycling fatigue and deformation mechanism in aluminum alloy thin films on silicon

Journal of Materials Research

Volumn 13, Issue 11, 1998, Pages 3256-3264

  Koike, J ^a   Utsunomiya, S ^a   Shimoyama, Y ^a   Maruyama, K ^a   Oikawa, H ^a  

^a TOHOKU UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ANNEALING; CRACK PROPAGATION; CRYSTAL MICROSTRUCTURE; DEFORMATION; DELAMINATION; DISLOCATIONS (CRYSTALS); FATIGUE OF MATERIALS; SILICON; SPUTTER DEPOSITION; STRESS RELAXATION; THERMAL CYCLING; THIN FILMS;

FILM CURVATURE; ISOTHERMAL ANNEALING; THERMAL CYCLING FATIGUE;

ALUMINUM ALLOYS;

EID: 0032205854     PISSN: 08842914     EISSN: None     Source Type: Journal    
DOI: 10.1557/JMR.1998.0442     Document Type: Article

References (29)

1. C. J. Santoro, J. Electrochem. Soc. 116, 361 (1969).
2. W. B. Pennebaker, J. Appl. Phys. 40, 394 (1969).
3. P. Chaudhari, J. Appl. Phys. 45, 4339 (1974).
4. M. Ronay and C. F. Aliotta, Philos. Mag. A 42, 161 (1980).
5. F. Ericson, N. Kristensen, and J-A. Schweitz, J. Vac. Sci. Technol. B9, 58 (1991).
6. B. C. Martin, C. J. Tracy, J. W. Mayer, and L. E. Hendrickson, Thin Solid Films 271, 64 (1995).
7. F. Y. Genin and W. J. Siekhaus, J. Appl. Phys. 79, 3560 (1996).
8. F. G. Yost, Scripta Metall. 23, 1323 (1989).
9. W. Tice and G. Slusser, J. Vac. Sci. Technol. B8, 106 (1990).
10. M. A. Korhonen, C. A. Paszkiet, and C-Y. Li, J. Appl. Phys. 69, 8083 (1991).
11. S. M. Hu, Appl. Phys. Lett. 59, 2685 (1991).
12. R. W. Vook and F. Witt, J. Appl. Phys. 36, 2169 (1965).
13. A. K. Sinha and T. T. Sheng, Thin Solid Films 48, 117 (1978).
14. P. A. Flinn, D. S. Gardner, and W. D. Nix, IEEE Trans. Elec. Dev. ED34, 689 (1987).
15. D. S. Gardner and P. A. Flinn, J. Appl. Phys. 67, 1831 (1990).
16. J-H. Jou and C-S. Chung, Thin Solid Films 235, 149 (1993).
17. C. A. Volkert, C. F. Alofs, and J. R. Liefting, J. Mater. Res. 9, 1147 (1994).
18. M. Murakami, Thin Solid Films 55, 101 (1978).
19. V. M. Koleshko, V. F. Belitsky, and I. V. Kiryushin, Thin Solid Films 142, 199 (1986).
20. G. G. Stoney, Proc. R. Soc. London, Ser. A 82, 172 (1909).
21. P. H. Townsend, D. M. Barnett, and T. A. Brunner, J. Appl. Phys. 62, 4438 (1987).
22. A. Witvrouw, J. Proost, B. Deweerdt, Ph. Roussel, and K. Maex, in Thin Films: Stresses and Mechanical Properties V, edited by S. P. Baker, C. A. Ross, P. H. Townsend, C. A. Volkert, and P. Børgesen (Mater. Res. Soc. Symp. Proc. 356, Pittsburgh, PA, 1995), p. 441.
23. N. Kristensen, F. Ericson, and J-A. Schweitz, Thin Solid Films 197, 67 (1991); J. Appl. Phys. 69, 2097 (1991).
24. N. Kristensen, F. Ericson, and J-A. Schweitz, Thin Solid Films 197, 67 (1991); J. Appl. Phys. 69, 2097 (1991).
25. H. J. Frost and M. F. Ashby, Deformation Mechanism Maps (Perg-amon Press, Oxford, 1982).
26. M. D. Thouless, J. Gupta, and J. M. E. Harper, J. Mater. Res. 8, 1845 (1993).
27. L. B. Freund, J. Appl. Phys. 68, 2073 (1990).
28. V. T. Gillard, W. D. Nix, and L. B. Freund, J. Appl. Phys, 76, 7280 (1994).
29. D. Jossel, Acta Metall. Mater. 42, 1031 (1994).