Residual-mechanical behavior of thermomechanically fatigued Sn-Ag based solder joints

Journal of Electronic Materials

Volumn 31, Issue 9, 2002, Pages 946-952

  Lee, J G ^a   Guo, F ^a   Choi, S ^a   Subramanian, K N ^a   Bieler, T R ^a   Lucas, J P ^a  

^a Michigan State University   (United States)

Author keywords

Sn Ag based; Solder; Thermomechanical fatigue

Indexed keywords

COOLING; CREEP; FATIGUE OF MATERIALS; HEATING; SHEAR STRENGTH; SUBSTRATES; THERMAL EXPANSION; THERMOMECHANICAL TREATMENT; TIN ALLOYS;

THERMOMECHANICAL FATIGUE;

SOLDERED JOINTS;

EID: 0036739119     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-002-0188-2     Document Type: Article

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