SCOPUS 정보 검색 플랫폼

IEEE Transactions on Components and Packaging Technologies

Volumn 24, Issue 1, 2001, Pages 10-15

Thermal cycling aging effects on microstructural and mechanical properties of a single PBGA solder joint specimen

(4) Pang, John H L a Tan, Kwang Hong a Shi, Xunqing b Wang, Z P b

a NANYANG TECHNOLOGICAL UNIVERSITY (Singapore)

b SINGAPORE INSTITUTE OF MANUFACTURING TECHNOLOGY (Singapore)

Author keywords

Eutectic solder; Microstructure; Solder joint; Thermal cycling

Indexed keywords

AGING OF MATERIALS; EUTECTICS; FATIGUE OF MATERIALS; INTERMETALLICS; METALLOGRAPHIC MICROSTRUCTURE; SOLDERED JOINTS; SOLDERING ALLOYS; STRENGTH OF MATERIALS; THERMAL CYCLING;

PLASTIC BALL GRID ARRAYS (PBGA); THERMAL CYCLING AGING EFFECTS;

ELECTRONICS PACKAGING;

EID: 0035278818 PISSN: 15213331 EISSN: None Source Type: Journal
DOI: 10.1109/6144.910796 Document Type: Article

Times cited : (44)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.