Modeling thermomechanical fatigue behavior of Sn-Ag solder joints

Journal of Electronic Materials

Volumn 31, Issue 11, 2002, Pages 1152-1159

  Lee, J G ^a   Telang, A ^a   Subramanian, K N ^a   Bieler, T R ^a  

^a Michigan State University   (United States)

Author keywords

Sn Ag; Solder joints; Thermomechanical fatigue

Indexed keywords

ANISOTROPY; COOLING; ELASTICITY; FATIGUE OF MATERIALS; HEATING; MATHEMATICAL MODELS; PLASTICITY; STRESSES; THERMAL EFFECTS; THERMAL EXPANSION; THERMOMECHANICAL TREATMENT; TIN ALLOYS;

THERMOMECHANICAL FATIGUE; TIN SILVER ALLOYS;

SOLDERED JOINTS;

EID: 0036867034     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-002-0004-z     Document Type: Article

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