Evolution, challenge, and outlook of TSV, 3D IC integration and 3d silicon integration

Proceedings - International Symposium on Advanced Packaging Materials

Volumn , Issue , 2011, Pages 462-488

  Lau, John H ^a  

^a INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE   (Taiwan)

Author keywords

3D IC integration; 3D Si integration; active and passive interposers; C2W and W2W bonding; TSV

Indexed keywords

3-D INTEGRATION; 3D IC INTEGRATION; 3D SI INTEGRATION; ACTIVE AND PASSIVE INTERPOSERS; IC PACKAGING; ROAD-MAPS; SILICON INTEGRATION; TSV;

ELECTRONICS PACKAGING; INTEGRATION; PACKAGING; PACKAGING MATERIALS;

THREE DIMENSIONAL;

EID: 84856481677     PISSN: 15505723     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ISAPM.2011.6105753     Document Type: Conference Paper

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92. Kannan, S., S. Evana, A. Gupta, B. Kim and L. Li, "3-D Copper Based TSV for 60-GHz Applications", IEEE ECTC Proceedings, Orlando, Florida, June 2011, pp. 1168-1175.
93. Spiller, S., F. Molina, J. Wolf, J. Grafe, A. Schenke, D. Toennies, M. Hennemeyer, T. Tabuchi, H. Auer, "Processing of Ultrathin 300 mm Wafers with Carrierless Technology", IEEE ECTC Proceedings, Orlando, Florida, June 2011, pp. 984-988.
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95. Sukumaran, V., T. Bandyopadhyay, Q. Chen, N. Kumbhat, F. Liu, R. Pucha, Y. Sato, M. Watanabe, K. Kitaoka, M. Ono, Y. Suzuki, C. Karoui, C. Nopper, M. Swaminathan, V. Sundaram, and R. Tummala, "Design, Fabrication and Characterization of Low-Cost Glass Interposers with Fine-Pitch Through-Package-Vias", IEEE ECTC Proceedings, Orlando, Florida, June 2011, pp. 583-588.
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101. Zhang, R., S. Lee, D. Xiao, H. Chen, "LED Packaging using Silicon Substrate with Cavities for Phosphor Printing and Copper-filled TSVs for 3D Interconnection", IEEE ECTC Proceedings, Orlando, Florida, June 2011, pp. 1616-1621.
102. Zhou, Z., C. Liu, X. Wang, X. Luo, and S. Liu, "Integrated Process for Silicon Wafer Thinning", IEEE ECTC Proceedings, Orlando, Florida, June 2011, pp. 1811-1814.
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