3D silicon integration

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2008, Pages 538-543

  Knickerbocker, J U ^a   Andry, P S ^a   Dang, B ^a   Horton, R R ^a   Patel, C S ^a   Polastre, R J ^a   Sakuma, K ^b   Sprogis, E S ^c   Tsang, C K ^a   Webb, B C ^a   Wright, S L ^a  

^a IBM T J WATSON RESEARCH CENTER   (United States)

^b IBM RESEARCH TOKYO   (Japan)

^c IBM   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

FINE PITCH;

AUTOMOBILE ELECTRONIC EQUIPMENT; AUTOMOBILE PARTS AND EQUIPMENT; CELLULAR TELEPHONE SYSTEMS; CHIP SCALE PACKAGES; COMPUTATION THEORY; COMPUTER NETWORKS; COPPER; CUSTOMER SATISFACTION; DIES; ELECTRIC POWER TRANSMISSION; ELECTRONIC EQUIPMENT MANUFACTURE; HIGH PERFORMANCE LIQUID CHROMATOGRAPHY; LAW ENFORCEMENT; MINIATURE INSTRUMENTS; NONMETALS; ORES; SEMICONDUCTING SILICON COMPOUNDS; SILICON; TECHNOLOGY; TELECOMMUNICATION EQUIPMENT; THREE DIMENSIONAL; TUNGSTEN; TUNGSTEN METALLURGY;

SILICON WAFERS;

EID: 51349137210     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2008.4550025     Document Type: Conference Paper

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