Thermal management of 3D IC integration with TSV (Through silicon via)

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2009, Pages 624-640

  Lau, John H ^a   Yue, Tang Gong ^b  

^a HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Hong Kong)

^b United Test and Assembly Center (UTAC)   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

ASPECT RATIO; COMPUTATIONAL FLUID DYNAMICS; COPPER; ELECTRONICS PACKAGING; INTEGRATED CIRCUIT INTERCONNECTS; NETWORK COMPONENTS; SILICON; THERMAL MANAGEMENT (ELECTRONICS); TIMING CIRCUITS;

DESIGN CHARTS; EMPIRICAL EQUATIONS; ENGINEERING PRACTICES; EQUIVALENT THERMAL; HOTSPOT TEMPERATURE; JUNCTION TEMPERATURES; THERMAL PERFORMANCE; THROUGH-SILICON-VIA;

THREE DIMENSIONAL INTEGRATED CIRCUITS;

EID: 70349666726     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2009.5074080     Document Type: Conference Paper

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