Effect of heat-spreader sizes on the thermal performance of large cavity-down plastic ball grid array packages

Journal of Electronic Packaging, Transactions of the ASME

Volumn 121, Issue 4, 1999, Pages 242-248

  Lau, J ^a   Chen, T ^a   Lee, S W R ^a  

^a Express Packaging Systems Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0012041557     PISSN: 10437398     EISSN: 15289044     Source Type: Journal    
DOI: 10.1115/1.2793847     Document Type: Article

References (8)

1. Lau, J., and Chen, K., 1997, “Thermal and Mechanical Evaluations of a Cost-Effective Plastic Ball Grid Array Package,” ASME Transactions, Journal of Electronic Packaging, Vol. 119, pp. 208-212.
2. Lau, J., and Pao, Y., 1997, Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies, McGraw-Hill, New York.
3. Lau, J. H., et al., 1998, “Single-Core Two-Side Substrate with /x-Strip and CoPlane Signal Trace, and Power and Ground Planes Through Split-Wrap-Around (SWA) or Split-Via-Connections (SVC) for Packaging IC Devices,” US Patent No. 5, 825, 084.
4. Lau, J., and Chen, T., 1998, “Cooling Assessment and Distribution of Heat Dissipation of A Cavity Down Plastic Ball Grid Array Package—NuBGA,” IMAPS Transactions, International Journal of Microcircuits & Electronic Packaging, Vol. 21, No. 1. pp. 109-118.
5. Lau, J., and Chou, T., 1998, “Electrical Design of a Cost-Effective Thermal Enhanced Plastic Ball Grid Array Package—NuBGA,” IEEE Transactions on CPMT, Part B, Vol. 21, No. 1, pp. 35-42.
6. Lau, J., Chen, K., and Wu, F., 1998, “Thermal Performance of a Low-Cost Thermal Enhanced Plastic Ball Grid Array Package—NuBGA,” Microelectronics International, Vol. 15, No. 2, pp. 25-33.
7. Lau, J., Chen, T., and Chou, T., 1998, “Design, Analysis, and Measurement of the Cost Effective Substrate of a Plastic Ball Grid Array Package—NuBGA,” Circuit World, Vol. 25, No. 2, pp. 41-48.
8. Tummala, R., Rymaszewski, E., and Klopfenstein, A., 1997, Microelectronics Packaging Handbook, Chapman & Hall, New York.