Design and fabrication of bandpass filters in glass interposer with through-package-vias (TPV)

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2010, Pages 530-535

  Sridharan, Vivek ^a   Min, Sunghwan ^a   Sundaram, Venky ^a   Sukumaran, Vijay ^a   Hwang, Seunghyun ^a   Chan, Hunter ^a   Liu, Fuhan ^a   Nopper, Christian ^b   Tummala, Rao ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

^b STMICROELECTRONICS   (France)

Author keywords

[No Author keywords available]

Indexed keywords

AREA REDUCTION; EMBEDDED PASSIVES; HIGH RESISTIVITY SILICON; MEASURED RESULTS; PARASITICS; RETURN LOSS; STOPBAND;

GLASS; PASSIVE FILTERS;

BANDPASS FILTERS;

EID: 77955218859     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2010.5490917     Document Type: Conference Paper

References (11)

1. R. R. Tummala and J. Laskar, "Gigabit wireless: system-on-a-package technology," Proceedings of the IEEE, vol.92, pp. 376-387, 2004.
2. "Advanced Design System (ADS) ", Agilent EEs of EDA, 2008.
3. "Sonnet Suite," Sonnet Software Inc., 2008.
4. H. Jia-Sheng and M. J. Lancaster., Microstrip filters for RF/microwave applications. New York: Wiley-Interscience, 2001.
5. C. T. Chiu, et al., "Design of Miniature Bandpass Filters Embedded in the Organic Substrate for RF SOP Applications," in Microwave Conference, 2006. 36th European, 2006, pp. 502-505.
6. L. K. Yeung, et al., "Low-temperature cofired ceramic LC filters for RF applications [Applications Notes]," Microwave Magazine, IEEE, vol.9, pp. 118-128, 2008.
7. L. Wing-Yan, et al., "Multilayer LTCC bandpass filter design with enhanced stopband characteristics," Microwave and Wireless Components Letters, IEEE, vol.12, pp. 240-242, 2002.
8. S. Hwang., et al., "A compact third-order 5 GHz bandpass filter with enhanced stopband characteristics," presented at the Radio and Wireless Conference, New Orleans, LA, 2010.
9. S. Min, et al., "Filter integration in ultra thin organic substrate via 3D stitched capacitor," in Electrical Design of Advanced Packaging & Systems Symposium, 2009. (EDAPS 2009). IEEE, 2009, pp. 1-4.
10. R. R. Tummala, et al., "Trend from ICs to 3D ICs to 3D systems," in Custom Integrated Circuits Conference, 2009. CICC '09. IEEE, 2009, pp. 439-444.
11. V. Sukumaran, et al., "Through-Package-Via Formation and Metallization of Glass Interposers," in Electronic Components and Technology Conference, 2010. ECTC 2010. 60th, 2010.