Electrical characterization of 3D Through-Silicon-Vias

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2010, Pages 1100-1105

  Liu, F ^a   Gu, X ^a   Jenkins, K A ^a   Cartier, E A ^a   Liu, Y ^a   Song, P ^a   Koester, S J ^a  

^a IBM T J WATSON RESEARCH CENTER   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVE WAFER BONDING; CHARACTERIZATION METHODS; ELECTRICAL CHARACTERIZATION; ELECTRICAL PROPERTY; EYE DIAGRAMS; FREQUENCY-DEPENDENT CAPACITANCE; INDUCTANCE EXTRACTION; LCR METERS; LOW FREQUENCY; MEASUREMENT TECHNIQUES; REFLECTION COEFFICIENTS; SIMULATION DATA; SYSTEM APPLICATIONS; TEST STRUCTURE; THROUGH SILICON VIAS; TRANSMISSION LINE;

CAPACITANCE; TUNGSTEN; WAFER BONDING;

SILICON WAFERS;

EID: 77955226786     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2010.5490839     Document Type: Conference Paper

References (9)

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