Silicon interposer technology for high-density package

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2000, Pages 1455-1459

  Matsuo, Mie ^a   Hayasaka, Nobuo ^a   Okumura, Katsuya ^a   Hosomi, Eiichi ^a   Takubo, Chiaki ^a  

^a TOSHIBA CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

FLIP CHIP DEVICES; LSI CIRCUITS; PERMITTIVITY; PRINTED CIRCUIT DESIGN; REACTIVE ION ETCHING; SEMICONDUCTING SILICON; SILICON WAFERS; SUBSTRATES; THERMAL EXPANSION;

BACKSIDE GRINDING; COEFFICIENT OF THERMAL EXPANSION; PHOTOSENSITIVE POLYIMIDE; SILICON INTERPOSER TECHNOLOGY;

ELECTRONICS PACKAGING;

EID: 0034483014     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (3)