Design, fabrication and characterization of low-cost glass interposers with fine-pitch through-package-vias

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2011, Pages 583-588

  Sukumaran, Vijay ^a   Bandyopadhyay, Tapobrata ^a   Chen, Qiao ^a   Kumbhat, Nitesh ^a   Liu, Fuhan ^a   Pucha, Raghu ^a   Sato, Yoichiro ^b   Watanabe, Mitsuru ^b   Kitaoka, Kenji ^b   Ono, Motoshi ^b   Suzuki, Yuya ^c   Karoui, Choukri ^d   Nopper, Christian ^d   Swaminathan, Madhavan ^a   Sundaram, Venky ^a   Tummala, Rao ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

^b ASAHI GLASS CO LTD   (Japan)

^c ZEON CORPORATION   (Japan)

^d STMicrolectronics Research and Development   (France)

Author keywords

Electrical design; fine line wiring; Glass interposer; laser ablation; mechanical modeling; through package via

Indexed keywords

3-D INTEGRATION; BUILD-UP LAYERS; ELECTRICAL CHARACTERIZATION; ELECTRICAL DESIGN; FINE LINE WIRING; FINE PITCH; HIGH COSTS; HIGH THROUGHPUT; INSULATING PROPERTIES; INTEGRATION PROCESS; LASER PROCESS; LOW COSTS; LOW INSERTION LOSS; MECHANICAL DESIGN; MECHANICAL MODELING; ORGANIC SUBSTRATE; THIN GLASS; THROUGH PACKAGE VIA; ULTRATHIN GLASS; WIRING DENSITY;

ABLATION; CHIP SCALE PACKAGES; DESIGN; DIES; DIMENSIONAL STABILITY; ELECTRIC PROPERTIES; GLASS; INTEGRATION; SEMICONDUCTING SILICON COMPOUNDS; SILICON WAFERS; SUBSTRATES; THREE DIMENSIONAL;

GLASS LASERS;

EID: 79960426887     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2011.5898571     Document Type: Conference Paper

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