Development of high accuracy wafer thinning and pickup technology for thin wafer(die)

2010 IEEE CPMT Symposium Japan, ICSJ10

Volumn , Issue , 2010, Pages

  Miyazaki, Chuichi ^a   Shimamoto, Haruo ^a   Uematsu, Toshihide ^a   Abe, Yoshiyuki ^b   Kitaichi, Kosuke ^b   Morifuji, Tadahiro ^a   Yasunaga, Shoji ^c  

^a Association of Super Advanced Electronics Technology (ASET)   (Japan)

^b RENESAS TECHNOLOGY CORP   (Japan)

^c ROHM CO LTD   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

DIE TECHNOLOGY; NEW TECHNOLOGIES; NON-CONTACT; PICKING UP; THIN WAFERS; TOOL DESIGNS; ULTRA THIN DIES; ULTRA-THIN; WAFER THINNING;

MACHINE DESIGN;

DIES;

EID: 79251554139     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/CPMTSYMPJ.2010.5679528     Document Type: Conference Paper

References (1)

1. C. Miyazaki, et. al "Development of wafer thinning and dicing technology for thin wafer", 3D-IC 2009, Sep.2009.