Development of Super Thin TSV PoP

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2011, Pages 274-278

  Yoon, Seung Wook ^a   Ishibashi, Kazuo ^b   Dzafir, Shariff ^a   Prashant, Meenakshi ^a   Marimuthu, Pandi Chelvam ^a   Carson, Flynn ^c  

^a STATS CHIPPAC LTD   (Singapore)

^b Nokia Japan   (Japan)

^c STATS ChipPAC Ltd   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

3D PACKAGING; ASSEMBLY PROCESS; CELLULAR PHONE; COMPONENT LEVELS; ELECTRICAL PERFORMANCE; FLIP CHIP; LAMINATE SUBSTRATES; MICROSYSTEM DEVICES; MOBILE APPLICATIONS; RELIABILITY TEST; SEMICONDUCTOR INDUSTRY; TEST VEHICLE; THICKNESS REDUCTION; THROUGH-SILICON-VIA; TIMING DELAY; WAFER LEVEL PACKAGE; WARPAGES;

BEHAVIORAL RESEARCH; CHIP SCALE PACKAGES; DIES; SEMICONDUCTOR DEVICE MANUFACTURE; SILICON WAFERS; TECHNOLOGY; TESTING; THREE DIMENSIONAL; VEHICLES;

PACKAGING;

EID: 79960409855     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2011.5898525     Document Type: Conference Paper

References (4)

1. Seung Wook Yoon, "Challenges and opportunity in 3D TSV interposer packaging", 3D Packaging, Yole Technology, February 2011 (2011)
2. Seung Wook Yoon, Nathapong Suthiwong sunthorn, Dae Wook Yang, Meenakshi Padmanathan, Jae Hoon Koo, Pandi Chelvam Marimuthu, Il Kown Shim and Flynn Carson N, "3D TSV process characterization and its assembly/packaging technology", IEEE 3D conference 2009, San Francisco, US. (2009)
3. Flynn Carson, Kazuo Ishibashi, Seung Wook Yoon, Pandi Chelvam Marimuthu, "Development of Super Thin TSV PoP", IEEE CPMT Symposium, Japan, 24-28 Aug. 2010. (2010)
4. Ishibashi, Kazuo, "PoP board assembly in mobile devices", SEMI Technology Symposium (STS), Semicon Japan Dec. 2008. (2008)