Study of the thermo-mechanical behavior of glass interposer for flip chip packaging applications

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2011, Pages 634-638

  Lin, Y J ^a   Hsieh, C C ^a   Yu, C H ^a   Tung, C H ^a   Yu, Doug C H ^a  

^a TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

FINITE ELEMENT MODELING; FLIP-CHIP PACKAGES; FLIP-CHIP PACKAGING; FOUR-POINT BENDING TEST; GLASS SUBSTRATES; GLASS SURFACES; HIGH STRESS CONCENTRATION; LOW CTE; OPTIMAL CHOICE; ORGANIC SUBSTRATE; PACKAGE STRUCTURE; PACKAGING SYSTEM; SIMULATION RESULT; STRESS LEVELS; STRESS MITIGATION; THERMAL STRESSING; THERMO-MECHANICAL BEHAVIORS; VIA DENSITY;

BRITTLE FRACTURE; CHIP SCALE PACKAGES; DIES; GLASS; OPTIMIZATION; PACKAGING; PRINTED CIRCUIT BOARDS; STRESS CONCENTRATION; SUBSTRATES;

BENDING (FORMING);

EID: 79960386407     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2011.5898579     Document Type: Conference Paper

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